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 NPN-Silizium-Fototransistor im SMT-Gehause Silicon NPN Phototransistor in SMT Package SFH 3201
Vorlaufige Daten / Preliminary Data
Wesentliche Merkmale * Speziell geeignet fur Anwendungen im Bereich von 460 nm bis 1080 nm * Hohe Linearitat * SMT-Bauform ohne Basisanschlu, geeignet fur Vapor Phase-Loten, IR-Reflow-Loten (JEDEC level 4) und Wellenloten (JEDEC level 4) * Nur gegurtet lieferbar Anwendungen * Umgebungslicht-Detektor * Lichtschranken fur Gleich- und Wechsel-lichtbetrieb * Industrieelektronik * Messen/Steuern/Regeln" Typ Type SFH 3201 SFH 3201-2/3 Bestellnummer Gehause Ordering Code Package Q62702-P5043 Q62702-P5209 P-DSO-6 P-DSO-6 Features * Especially suitable for applications from 460 nm to 1080 nm * High linearity * SMT package without base connection, suitable for vapor phase, IR reflow soldering (JEDEC level 4) and wave soldering (JEDEC level 4) * Available only on tape and reel Applications * * * * Ambient light detector Photointerrupters Industrial electronics For control and drive circuits
2002-12-06
1
SFH 3201
Grenzwerte Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Kollektor-Emitterspannung Collector-emitter voltage Kollektor-Emitterspannung, t < 120 s Collector-emitter voltage Kollektorstrom Collector current Kollektorspitzenstrom, < 10 s Collector surge current Emitter-Kollektorspannung Emitter-collector voltage Verlustleistung, TA = 25 C Total power dissipation Warmewiderstand fur Montage auf PC-Board Thermal resistance for mounting on pcb Symbol Symbol Wert Value - 40 ... + 100 20 70 50 100 7 120 500 Einheit Unit C V V mA mA V mW K/W
Top; Tstg VCE VCE IC ICS VEC Ptot RthJA
2002-12-06
2
SFH 3201
Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der max. Fotoempfindlichkeit Wavelength of max. sensitivity Spektraler Bereich der Fotoempfindlichkeit S = 10% von Smax Spectral range of sensitivity S = 10% of Smax Bestrahlungsempfindliche Flache Radiant sensitive area Abmessung der Chipflache Dimensions of chip area Halbwinkel Half angle Kapazitat, VCE = 0 V, f = 1 MHz, E = 0 Capacitance Dunkelstrom Dark current VCE = 20 V, E = 0 Symbol Symbol S max Wert Value 850 460 ... 1080 Einheit Unit nm nm
A LxB LxW
0.55 1x1 60 15 3 ( 200)
mm2 mm x mm Grad deg. pF nA
CCE ICEO
2002-12-06
3
SFH 3201
Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern gekennzeichnet. The phototransistors are grouped according to their spectral sensitivity and distinguished by arabian figures. Bezeichnung Parameter Fotostrom, = 950 nm Photocurrent Ee = 0.1 mW/cm2, VCE = 5 V Ev = 1000 Ix, Normlicht/ standard light A, VCE = 5 V Anstiegszeit/Abfallzeit Rise and fall time IC = 1 mA, VCC = 5 V, RL = 1 k Kollektor-EmitterSattigungsspannung Collector-emitter saturation voltage IC = IPCEmin1) x 0.3, Ee = 0.1 mW/cm2
1) 1)
Symbol Symbol -1 -2
Wert Value -3
Einheit Unit
IPCE IPCE tr, tf
63 ... 125 1.65 16
100 ... 200 2.6 24
160 ... 320 4.2 34
A mA s
VCEsat
170 ( 250)
170 ( 250)
170 ( 250)
mV
IPCEmin ist der minimale Fotostrom der jeweiligen Gruppe. IPCEmin is the min. photocurrent of the specified group.
Directional Characteristics Srel = f ()
40 30 20 10
0 1.0
OHF01402
50 0.8 60
0.6
70
0.4
80
0.2 0
90
100
1.0
0.8
0.6
0.4
0
20
40
60
80
100
120
2002-12-06
4
SFH 3201
TA = 25 C, = 950 nm
Rel. Spectral Sensitivity, Srel = f ()
100 S rel % 80 70 60 50 40 30 20 10 0 400 500 600 700 800 900 nm 1100
10 -4 -3 10 10 -2 mW/cm 2 Ee 10 0 10 -3 10 -2 10
-1
Photocurrent IPCE = f (Ee), VCE = 5 V
pce
10 1 mA 1 2 3
OHF00326
Total Power Dissipation Ptot = f (TA)
140 Ptot mW 120 100 80 60 40 20 0
OHF00309
OHF02332
10 0
0
20
40
60
80 C 100 TA
Photocurrent IPCE = f (TA), VCE = 5 V, normalized to 25 C
PCE 25
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -25
Dark Current ICEO = f (VCE), E = 0
CEO
10 2 nA
OHF02341
Dark Current ICEO = f (TA), VCE = 10 V, E = 0
CEO
10 3 nA
OHF02342
PCE
1.6
OHF01524
10 1
10 2
10 0
10 1
10 -1
10 0
10 -2
0 25 50 75 C 100 TA
0
10
20
30
40
50
V 70 V CE
10 -1 0
20
40
60
80 C 100 TA
Photocurrent
IPCE = f (VCE)
pce
3.0 mA 2.5 1.0 mW/cm 2
OHF00327
Collector-Emitter Capacitance CCE = f (VCE), f = 1 MHz
C CE 20 pF
OHF02344
15
2.0
1.5 0.5 mW/cm 2 1.0 0.25 mW/cm 2 0.5 0.1 mW/cm 2 0 0 10 20 30 40 50 60 V 70 Vce
10
5
0 -2 10
10 -1
10 0
10 1
V 10 2 VCE
2002-12-06
5
SFH 3201
Mazeichnung Package Outlines
0...0.1 (0...0.004)
0.2 M A
0.15 (0.006) 0.13 (0.005)
6.2 (0.244)
A 5.8 (0.228) 3.4 (0.134) 3.0 (0.118)
4.2 (0.165) 3.8 (0.150)
B
Active area 0.55 (0.022)
0.5 (0.020) 0.3 (0.012)
1 2 3 6 5 4
0.1 M B 1 2 3 Emitter 4
0.7 (0.028) 0.4 (0.016)
1.27 (0.050) spacing
5 -
Collector
2.54 (0.100) spacing
6 GEOY6982
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2002-12-06
6
2.1 (0.083) 1.7 (0.067)
SFH 3201
Lothinweise Soldering Conditions Bauform Type Drypack Tauch-, Schwalllotung Reflowlotung Level acc. Dip, Wave Soldering Reflow Soldering to IPS-stand. Peak Temp. Max. Time in Peak Temp. Max. Time 020 (solderbath) Peak Zone (package in Peak temp.) Zone 4 260 10 s 245 C 10 s Kolbenlotung Iron Soldering (Iron temp.)
SFH 3201
n.a.
Bitte Verarbeitungshinweise fur SMT-Bauelemente beachten! Please observe the handling guidelines for SMT devices!
Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2002-12-06 7


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